Ⅰ、ENPI 200 series
Resist Film Thickness:2~6um
ENPI 300 series
Resist Film Thickness:1~20um
Property:
1. High thermal resistance;
2. High resolution;
3. Wide angle margin of pattern.
Ⅱ、Application Fields:
1. LED Chip Manufacturing：
Used for the fabrication of metal electrodes on LED chips to improve light extraction efficiency.
2. Display Panel (OLED)：
Applied for the patterning of pixel pillars/ribs and metal electrodes in PMOLED and AMOLED devices.
3. Advanced IC Packaging：
Widely used in 2.5D/3D packaging processes, including gold bumping, copper pillar fabrication, and RDL (redistribution layer) patterning.
4. MEMS Manufacturing：
Adopted for high-precision patterning of microsensors and microactuators in MEMS fabrication.
