Ⅰ、ECA 100 series
Resist Film Thickness:5~80um
Property:
1. High Sensitivity;
2. High Aspect Ratio;
3.Different viscosity series to meet a variety of customer needs.
Ⅱ、Application Fields
1. Logic Chip Manufacturing (Front-end Lithography)：
Chemically Amplified (CA) photoresists are widely adopted in front-end lithography processes for wafer fabrication. KrF photoresists cover process nodes from 0.35 μm to 130 nm, while ArF photoresists are applied for 130 nm to 45 nm nodes. ArF immersion photoresists support advanced processes down to 28 nm and even 14 nm, and are primarily used for core manufacturing processes of 12-inch wafers.
2. Memory Chip Manufacturing (DRAM, NAND Flash)：
CA photoresists play a vital role in the multi-layer patterning processes of memory chips, serving as one of the key materials that sustain the continuous improvement of storage density.
3. Advanced Packaging and MEMS：
Featuring high transparency and superior aspect ratio performance in thick-film coating, KrF CA photoresists are applied in multi-layer lithography processes for fan-out packaging, Through-Silicon Via (TSV) fabrication, and MEMS devices.
4. Power Devices and Special Semiconductors：
I-line photoresists and specially modified CA photoresists are suitable for trench etching and metal lift-off processes of wide-bandgap semiconductors (such as GaN and SiC), power devices and compound semiconductors.
5. Display Driver ICs and PMICs
The product portfolio supports the mass production of various analog and digital chips including display driver ICs and power management ICs.
