Ⅰ、EverPI® P Series
Resist Film Thickness:0~20um
EverPI® N Series
Resist Film Thickness:5~15um
Property:
1. Low curing temperature (180℃);
2. More excellent resolution;
3. Good chemical resistance;
4. Excellent adhesion to substrates;
5. PSPI can be used for FOPLP;
6. Negtive PSPI use 2.38%TMAH develop.
Ⅱ、Application Fields
1. OLED Display：
PSPI is the only material that can be simultaneously applied to three key thin-film processes in top-emission AMOLED production, including the planarization layer (PLN), pixel defining layer (PDL), and spacer layer. With excellent photosensitivity and high thermal stability, PSPI effectively reduces chromatic aberration of OLED devices and improves interlayer insulation performance.
2. Integrated Circuits and Semiconductor Advanced Packaging：
In advanced packaging processes, PSPI is commonly used as a buffer layer, passivation layer, and planarization layer for multi-layer interconnect structures, protecting specific chip regions from external mechanical stress. Particularly in redistribution layer (RDL) processes, PSPI acts as a mainstream insulating dielectric material, providing reliable electrical, mechanical, and thermal performance while enabling high-precision fine patterning. BoMi Technology’s photosensitive polyimide coatings are primarily applied to the advanced packaging of high-end chips, including AI and high-performance computing chips, memory chips, and automotive electronic chips.
3. Micro-Electro-Mechanical Systems (MEMS)：
PSPI is widely utilized as a dielectric insulation material between stacked layers and metal wires, as well as a structural material for component fabrication in MEMS manufacturing.
4. Aerospace and Special Industries：
Thanks to its excellent high-temperature resistance and superior insulating properties, PSPI is widely used in aircraft thermal insulation, electrical insulation components, and protective coatings for aerospace equipment and other special industrial applications.
