Application Fields:
1. Coarse polishing of large-size monocrystalline silicon wafers with high material removal rate (RR) requirements.
2. Polishing of silicon materials with strict limits on metallic ion impurities.
Silicon Wafer Polishing Slurry is a water-based abrasive slurry specially used for chemical mechanical planarization (CMP) of monocrystalline silicon wafers. As an essential core consumable for semiconductor wafer fabrication, it is applied to frontside and backside mirror finishing of 8/12-inch polished silicon wafers, epitaxial silicon wafers and SOI wafers.Combining alkaline chemical etching to soften the silicon surface layer and micro mechanical removal by nano abrasives, this slurry proces
1. Coarse polishing of large-size monocrystalline silicon wafers with high material removal rate (RR) requirements.
2. Polishing of silicon materials with strict limits on metallic ion impurities.