Application Fields:
Compatible with large-size ultra-thin glass wafers and capable of significantly reducing copper dishing.
关于我们
安光企业集团，深耕光刻胶与显影液研发生产，匠心打造优质电子材料，赋能半导体产业高质量发展。
安光企业集团，深耕光刻胶与显影液研发生产，匠心打造优质电子材料，赋能半导体产业高质量发展。
TGV (Through Glass Via) Polishing Slurry is a water-based slurry dedicated to wafer-level chemical mechanical planarization (CMP) of glass interposers, targeting advanced packaging processes including Chiplet, CoWoS, RF MEMS and Mini/Micro-LED glass carrier substrates.The TGV structure consists of borosilicate/quartz glass substrate, Ti barrier layer and Cu-filled vias. Key processing challenges include high brittleness of glass and a huge removal rate gap between copper and glass, which readily
Compatible with large-size ultra-thin glass wafers and capable of significantly reducing copper dishing.
