Application Fields
1. Mass production lines for SiC wafers
2. Special-shaped SiC components
3. SiC AR-coated wafers
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安光企业集团，深耕光刻胶与显影液研发生产，匠心打造优质电子材料，赋能半导体产业高质量发展。
安光企业集团，深耕光刻胶与显影液研发生产，匠心打造优质电子材料，赋能半导体产业高质量发展。
SiC Substrate Polishing Slurry is a water-based chemical mechanical polishing (CMP) slurry exclusively for single-crystal 4H/6H-SiC substrates of third-generation semiconductors, acting as a core consumable for automotive-grade power semiconductors, RF devices and new energy inverters.SiC boasts a Mohs hardness of 9.5 and extremely strong chemical inertness. Simple mechanical grinding will easily cause deep subsurface damage, scratches and lattice defects, which directly trigger leakage current
1. Mass production lines for SiC wafers
2. Special-shaped SiC components
3. SiC AR-coated wafers
